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    6608xxWVxxx

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    Specification

    Type Wafer
    Pitch 4.14 mm (0.163 in)
    Contact Type Wire to Board & Wire to Wire
    Series 6608
    Current rating 5A
    Voltang rating 600V AC / DC
    Withstand voltage 1500V AC / minute
    Insulation resistance 1000M Ω min
    Contact resistance 10m Ω max
    Temperature range -25℃ to + 105℃ (including temperature rise)
    Applicable PC board thickness 0.8 ~ 2.0 mm
    Circuits 2~4,A4,6,8~10,12,A12,14~16,18,20,22,24P
    Material Nylon 66 UL 94V-0
    Color Natural
    Drawing Drawing PDF Download
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