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    300200TPxxx

    300200TBxxx

    300200TMxxx

    300200TAxxx

    3002xxWJxxx

    3002xxWHxxx

    3002xxHFxxx

    3002xxWMxxx

    3002xxWDxxx

    3002xxWFxxx

    3002xxWRxxx

    3002xxWSxxx

    3002xxWVxxx

    3002xxHPxxx

    3002xxHMxxx

    3002xxWExxx
    Series

    300202WE

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    • Fullscreen
    • Wireframe
    • Zoom In
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    • Rotation
    • Screenshot
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    Controls

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    • Rotate with the left mouse button.
    • Zoom with the scroll button.
    • Adjust camera position with the right mouse button.
    • Double-click to enter the fullscreen mode.
    • On mobile devices swipe to rotate.
    • On mobile devices pinch two fingers together or apart to adjust zoom.
    • On mobile devices 3 finger horizontal swipe performs panning.
    • On mobile devices 3 finger horizontal swipe performs panning.
    Drawing PDF

    Drawing PDF Download

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    3002xxWExxx

    SKU N/A Categories , ,
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    Specification

    UL Approval E237407 Section.8
    Type Wafer
    Pitch 3.00 mm (0.118 in)
    Contact Type Wire to Board & Wire to Wire
    Series 3002
    Current rating 5A
    Voltang rating 250V AC / DC
    Withstand voltage 1500V AC / minute
    Insulation resistance 1000M Ω min
    Contact resistance 10m Ω max
    Temperature range -25℃ to + 105℃ (including temperature rise)
    Applicable PC board thickness 0.8 ~ 1.6 mm
    Circuits 02 – 12P
    Material Polyester LCP UL 94V-0
    Color Black
    Drawing Drawing PDF Download
    • No.89, Xinglong Rd., Pingzhen Dist, Taoyuan City 32460, Taiwan(R.O.C.)

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